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 MC33351A
Advanced Information Lithium Battery Protection Circuit for Three Battery Packs
The MC33351A is a monolithic lithium battery protection circuit that is designed to enhance the useful operating life of three cell rechargeable battery packs. The MC33351A is specifically designed to be placed in a lithium battery pack where the battery cells continuously power it. In order to maintain cell operation within specified limits, the protection circuit senses cell voltages, and discharge current, and correspondingly controls the state of two P-channel MOSFET switches. These switches are connected in series with the positive terminal of the third cell and the positive terminal of the battery pack. During a fault condition, the MC33351A open circuits the pack by turning off one of these MOSFET switches.
Features http://onsemi.com MARKING DIAGRAMS
20
1
TSSOP-20 DTB SUFFIX CASE 948E
* Selectable Charge Interrupt Voltage Sensing Mode for Precise Cell * Programmable Overvoltage Delay * Choice of Discharge Current Limit Sensing Elements consisting of * * * * *
Voltage Measurements
either Low-Side Resistor or High-Side MOSFET Switches Programmable Discharge Current Limit Threshold and Shutdown Delay Selectable Cell Voltage Balancing Virtually Zero Current Sleepmode State when Cells are Discharged Minimum External Components for Inclusion within the Battery Pack Available in Low Profile Surface Mount Package
Typical Three Cell Smart Battery Pack
VCC/ High-Side Discharge Current Limit 16 17 Cell 3 18 Balance 3 19 Cell 2 12
Discharge Gate Drive Output 7
Balance 2 14
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Charge Gate Drive Output 9
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MC35 1A1 ALYW
= Assembly Location = Wafer Lot = Year = Work Week
PIN CONNECTIONS
20 Balance 1 19 Balance 3 18 Cell 3 17 NC 16 Discharge Current
Limit VCC/High Side
Charge Inhibit Input
Charge and Discharge Gate Drive Common 8
Discharge Inhibit/ Test Input 2 Overvoltage Shutdown Delay 3 Discharge Current Limit Shutdown Delay 4 Low-Side Discharge Current Limit Input 5 Charge Interrupt Mode Select 6 Discharge Gate Drive Output 7 Charge and Discharge Gate Drive Common 8 Charge Gate Drive Output 9 Undervoltage Fault Output 10
15 Cell 1/VC 14 Balance 2 13 Ground 12 Cell 2 11 Discharge Current
Limit Threshold High-Side
(Top View)
Undervoltage Fault Output 10
MC33351A
ORDERING INFORMATION
Device MC33351ADTB-1 MC33351ADTB-1R2 Package TSSOP-20 TSSOP-20
Cell 1/VC 15 Balance 1 20 Ground 13 Overvoltage Shutdown Delay Charge 3 Interrupt 6 Mode Select 11 High-Side Discharge Current LimitThreshold 4 Discharge Current Limit Shutdown Delay 5 Low-Side Current Limit Input 1 Charge Inhibit Input
Shipping
2 Discharge Inhibit Input
(c) Semiconductor Components Industries, LLC, 2000
1
June, 2000 - Rev. 3
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Publication Order Number: MC33351A/D
MC33351A
Smart Battery Pack with Low-Side Discharge Current Sensing, Charge Interrupt Voltage Sensing, and Cell Voltage Balancing 4.7 M Discharge Switch Q2 Charge Switch Q1
RG VCC/ High-Side Discharge Current Limit 16 MC33351A
Discharge Gate Drive RG Output 7
Charge Gate Drive Output 9
Charge and Discharge Gate Drive Common 8
CI
17 R1 Cell 3 18 Balance 3 Cell 3 19 10 k Cell 2 12 10 k Balance 2 Cell 2 14 Cell 1/VC 15 10 k Balance 1 Cell 1 20 Ground 13 Cell Voltage Balancing Logic Ck Undervoltage Fault Output Over/Under Data Latch & Control Logic 10 Cell Selector Floating Over/Under Cell Voltage Detector & Reference
R2
R3 Control Logic Output To Microcontroller Input Port 5.1 k RT + 22 m fd CT
Ck Oscillator
En
Overvoltage Shutdown Delay 3 6 Charge Interrupt Mode Select
VCC
Discharge Current Limit Detector 11 High-Side Discharge Current Limit Threshold
Charge/Discharge Gate Drivers 10 k 5 Low-Side Discharge Current Limit Input VC 10 k
Sense Enable
4 Discharge Current Limit Shutdown Delay
Cdly Rlim(LS)
1 Charge Inhibit Input
2 Discharge Inhibit Input
Figure 1.
Control Logic Inputs from Microcontroller Output Ports
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MC33351A
Smart Battery Pack with High-Side Discharge Current Sensing 4.7 M Discharge Switch Q2 Charge Switch Q1
RG VCC/ High-Side Discharge Current Limit 16 MC33351A
Discharge Gate Drive Output 7
RG
Charge Gate Drive Output 9
Charge and Discharge Gate Drive Common 8
CI
17 R1 Cell 3 18 Balance 3 Cell 3 19 10 k Cell 2 12 10 k Balance 2 Cell 2 14 Cell 1/VC 15 10 k Balance 1 Cell 1 20 Ground 13 Cell Voltage Balancing Logic Ck Undervoltage Fault Output Over/Under Data Latch & Control Logic 10 Cell Selector Floating Over/Under Cell Voltage Detector & Reference
R2
R3 Control Logic Output To Microcontroller Input Port 5.1 k RT + 22 m fd CT
Ck Oscillator
En
Overvoltage Shutdown Delay 3 6 Charge Interrupt Mode Select
VCC
Discharge Current Limit Detector Rth(HS) 11 High-Side Discharge Current Limit Threshold
Charge/Discharge Gate Drivers 10 k 5 Low-Side Discharge Current Limit Input VC 10 k
Sense Enable
4 Discharge Current Limit Shutdown Delay
Cdly
1 Charge Inhibit Input
2 Discharge Inhibit Input
Figure 2.
Control Logic Inputs from Microcontroller Output Ports
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MC33351A
MAXIMUM RATINGS
Ratings Input Voltage (Measured with respect to Ground, Pin 13) Cell 1/Vc (Pin 15) Cell 2 (Pin 12) Cell 3 (Pin 18) Vcc/ High Side Discharge Current Limit (Pin 16) Charge Inhibit Input (Pin 1) Discharge Inhibit Input (Pin 2) Overvoltage Shutdown Delay (Pin 3) Discharge Current Limit Shutdown Delay (Pin 4) Low-Side Discharge Current Limit Input (Pin 5) Voltage Sampling Mode Select (Pin 6) Discharge Gate Drive Output (Pin 7) Charge Gate Drive Common (Pin 8) Charge Gate Drive Output (Pin 9) Undervoltage Fault Output (Pin 10) High-Side Current Limit Threshold (Pin 11) Cell Balancing Current (Note 1) Balance 3, Source Current (Pin 19) Balance 1, Balance 2 Sink Current (Pin 20, 14) Symbol VIR Value 7.5 10 18 20 7.5 7.5 7.5 20 7.5 7.5 18 20 18 20 7.5 50 50 10 Unit V
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Ibal mA Undervoltage Fault Output Sink Current (Pin 10) Iflt mA Thermal Resistance, Junction-to-Air DTB Suffix, TSSOP Plastic Package, Case 948E DW Suffix, SO-20L Plastic Package, Case 751D Operating Temperature (Note 1) Storage Temperature RJA C/W 135 105 TJ -40 to 150 -55 to 150 C C Tstg
ELECTRICAL CHARACTERISTICS (Vcell 3 (Pin 18) = 10.5V, Vcell 2 (Pin 12) = 7.0V, Vcell 1 (Pin 15) = 3.5V,
Cdly (Pin 4) = 1000 pF, TA = 25C) Characteristic Symbol Min Typ
Max
Unit
VOLTAGE SENSING
Cell Charging Cutoff (Pin 15 to 13, 12 to 15, 18 to 12) Overvoltage Threshold, VCell Increasing Delay Overvoltage Hysteresis, VCell Decreasing One Overvoltage Sample (Pin 3 = Gnd)
MC33351A-1
Vth(OV) VH
4.207 50 0 1.0
4.293 200 1.2 2.3 2.415 - -
V
125 - - 2.3 28
mV s s V
tdly(OV)
Two Consecutive Overvoltage Samples (Pin 3 = Vc) Cell Discharging Cutoff MC33351A-1 Vth(UV) IIB Undervoltage Threshold, VCell Decreasing
2.185 - -
Input Bias Current During Cell Voltage Sampling Cell Voltage Sampling Rate Charge Interrupt Enabled
A s
t(smpl)
1.0
Vth(Intrrpt)
V
Input Voltage Range (Pin 6) Disabled
- - -
(Vc/2+0.2 to Vc) (0 to Vc/2-0.2) 20
- - -
Enabled Charge Interrupt Time
tIntrrp
ms
NOTE:
1 Maximum package power dissipation limits must be observed.
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MC33351A
ELECTRICAL CHARACTERISTICS (Vcell 3 (Pin 18) = 10.5V, Vcell 2 (Pin 12) = 7.0V, Vcell 1 (Pin 15) = 3.5V,
Cdly (Pin 4) = 1000 pF, TA = 25C) Characteristic CELL VOLTAGE BALANCING Internal Balancing MOSFET On-Resistance Balance 3, (Pin 19) Balance 1, Balance 2 (Pin 20, 14) RDS(on) - - 100 50 - - Symbol Min Typ Max Unit
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CURRENT SENSING Threshold Voltage High-Side Discharge Current Limit (Pin 16 to Pin 8) Rpin 11 = 1.0 MW Rpin 11 = 2.0 MW Vth(HSdschg) 200 100 2.5 0.0 48 280 170 380 230 6.0 2.5 59 mV mV ms ms Delay Overcurrent Detect (Vsense = 250 mV) Short Circuit Detect (Vsense = 1.0 V) Low-Side Discharge Current Limit (Pin 13 to Pin 5) Threshold Voltage Delay tdly(HSdschg)
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Vth(LSdschg) - mV ms ms Overcurrent Detect (Vsense = 50 mV) tdly(LSdschg) 2.5 0.3 6.0 0.4 Short Circuit Detect (Vsense = 200 mV) LOGIC Charge and Discharge Inhibit Inputs (Pin 1, 2) Threshold Voltage Propagation Delay to Respective Gate Drive Output Low State Sink Resistance Vth(inhbt) tPL/H - - - - - Vc/2 100 100 100 16 - - - - - V s Undervoltage Fault Output (Pin 10)
W
Off State Leakage Current (Vdrain = 16V)
nA s
Detection Delay Time Before Discharge MOSFET Turn Off (Note 2) High State Source Resistance Low State Sink Resistance
Charge and Discharge Gate Drive Outputs (Pin 9, 7)
W
RDS(source) RDS(sink) ICC
- -
100 100
- -
TOTAL DEVICE
Average Cell Current
Operating (VCC = 12 V)
- -
15 -
20
A nA V
Sleepmode (VCC = 6.0 V) Cell 1 Voltage
500 - -
Minimum Operating Cell Voltage Cell 2, or Cell 3 Voltage
VCC
1.5 0.7
1.8 0.8
NOTE:
2 Refer to "Voltage Sensing" text of Operating Description. Guaranteed by Design Only; NOT TESTED.
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MC33351A
4.45 OVER VOLTAGE THRESHOLD (VOLTS) 4.40 4.35 4.30 4.25 4.20 4.15 -40 CHARGE ON THRESHOLD (VOLTS) -25 -10 5 20 35 50 65 80
4.35 4.30 4.25 4.20 4.15 4.10 4.05 -40
-20
0
20
40
60
80
TEMPERATURE (C)
TEMPERATURE (C)
Figure 3. Over Voltage Threshold versus Temperature
Figure 4. Charge ON Voltage Threshold versus Temperature
2.305 UNDERVOLTAGE THRESHOLD (VOLTS) DISCHARGE CURRENT (LOW SIDE) THRESHOLD IN MILLIVOLTS 2.300 2.295 2.290 2.285 2.280 2.275 2.270 2.265 -40 -20 0 20 40 60 80
60 58 56 54 52 50 48 46 44 42 40 -40
-20
0
20
40
60
80
TEMPERATURE (C)
TEMPERATURE (C)
Figure 5. Undervoltage Threshold versus Temperature
Figure 6. Discharge Current (Low Side) versus Temperature
DISCHARGE CURRENT THRESHOLD (mV) -20 0 20 40 60 80
210 DISCHARGE CURRENT (HIGH SIDE) THRESHOLD (MILLIVOLTS) 205 200 195 190 185 180 -40
350 330 310 290 270 250 230 210 190 170 150 0.7 0.9 1.1 1.3 1.5 1.7 1.9 2.1 RESISTANCE (mW )
TEMPERATURE (C)
Figure 7. Discharge Current (High Side) Threshold versus Temperature (R11 = 1.5 mOhms)
Figure 8. Discharge Current (High Side) versus Resistance
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MC33351A
4.2 4.0 3.8 IEE ( A) 3.6 3.4 3.2 3.0 9.5 3.4 3.0 7.0 I EE (nA) 4.2 3.8 5.0 4.6
10
10.5
11
11.5
12
7.5
8.0 VCC (V) = (3 X Vcell)
8.5
9.0
VCC (V) (3 X Vcell)
Figure 9. VCC versus IEE (No Load)
Figure 10. VCC versus IEE (Sleep-Mode)
250 TIME DELAY (I sense Vth to D gate) (ms) 200 150 100 50 0 0 5000 10000 Capacitance (pF) 15000 20000
Figure 11. Discharge Current Limit Shutdown Delay versus Capacitance
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MC33351A
PIN FUNCTION DESCRIPTION Pin No. 1 2 Function
Charge Inhibit Input
Description
A logic low level at this input will disable battery pack charging. A 10 k internal pull-up resistor connects from this pin to VC.
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Discharge Inhibit Input A logic low level at this input will disable battery pack discharging. A 10 k internal pull-up resistor connects from this pin to VC. Also, connecting this pin to 3.0V above VC the internal logic is held in reset state and both MOSFET switches are turned on.
3
Overvoltage Shutdown Delay
This input controls the required number of cell overvoltage events that must be detected before charge switch Q1 is turned off. With a logic level low at this input, charge switch Q1 turns off after a single overvoltage event is detected. With a logic level high, charge switch Q1 turns off after two successive overvoltage events are detected. A capacitor connects from this pin to ground and is used to program a time delay from when the discharge current limit is exceeded to when discharge switch Q2 is turned off.
4 5 6
Discharge Current Limit Shutdown Delay Low-Side Discharge Current Limit Input
This pin is used to monitor the load induced voltage drop that appears across current sensing resistor Rlim(LS). This voltage drop is sensed by pins 13 and 5.
Charge Interrupt Mode Select Discharge Gate Drive Output
The logic level that is applied to this input determines if the charge current will be interrupted during the cell voltage sampling period. The charge current is interrupted when this input is connected to VC, and not interrupted when connected to ground, pin 13. This output connects to the gate of discharge switch Q2 allowing it to enable or disable battery pack discharging.
7 8 9
Charge and Discharge Gate Drive Common Charge Gate Drive Output
This pin provides a gate turn-off path for charge switch Q1. The charge switch source and the battery pack positive terminal connect to this point. This output connects to the gate of charge switch Q1 allowing it to enable or disable battery pack charging.
10 11
Undervoltage Fault Output
This is an open drain output that is active low when an undervoltage fault limit has been exceeded. Discharge switch Q2 will turn off 16 seconds after the Fault goes low. A resistor connects from this pin to ground and is used to program the high-side discharge current limit threshold. The programmed threshold voltage is sensed by pins 16 and 8. This pin connects to a high impedance node of the Cell Selector where it is used to monitor the positive terminal of Cell 2 and the negative terminal of Cell 3. This is the protection IC ground and all voltage ratings are with respect to this pin.
High-Side Discharge Current Limit Threshold Cell 2
12 13 14 15
Ground
Balance 2 Cell 1/VC
This pin is used if cell balancing is desired. It connects to the drain of an internal N-channel MOSFET and is active low during the balancing of Cell 2. This is a multi-function pin that connects to a high impedance node of the Cell Selector where it is used to monitor the positive terminal of Cell 1 and the negative terminal of Cell 2. This pin also provides bias for the internal logic.
16
VCC/High-Side Discharge Current Limit
This is a multi-function pin that connects to a high impedance node of the Cell Selector where it is used to monitor the positive terminal of Cell 3 and to provide positive supply voltage for the protection IC. This pin can also be used for high-side discharge current limit protection by monitoring the load induced voltage drop that appears across the on-resistance of switches Q2 and diode of Q1. This voltage drop is sensed by pins 16 and 8. No Connection
17 18 19 20
NC
Cell 3
This pin connects to a high impedance node of the Cell Selector where it is used to monitor the positive terminal of Cell 3 and VCC.
Balance 3 Balance 1
This pin is used if cell balancing is desired. It connects to the drain of an internal P-channel MOSFET and is active high during the balancing of Cell 3.
This pin is used if cell balancing is desired. It connects to the drain of an internal N-channel MOSFET and is active low during the balancing of Cell 1.
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MC33351A
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Outputs MOSFET Switches (Note 3) Cell Balancing Balancing Outputs Input Conditions Cell Status Circuit Operation Battery Pack Status Charge Q1 Discharge Q2 CELL CHARGING/DISCHARGING Storage or Nominal Operation: No current or voltage faults Both Charge MOSFET Q1 and Discharge MOSFET Q2 are on. The battery pack is available for charging or discharging. On On Active CELL CHARGING FAULT/RESET Charge Voltage Limit Fault: VCell Vth(OV) for tdly(OV) tdly(OV) = 0 to 1.2 s, Pin 3 to 13 1.0 to 2.1 s, Pin 3 to 15 Charge MOSFET Q1 is latched off and the cells are disconnected from the charging source. An internal hysteresis voltage is generated when the overvoltage cell is sensed. The shutdown delay is programmable for either one or two successive overvoltage events by the state of Pin 3. The battery pack is available for discharging. On to Off On Active Charge Voltage Limit Reset: VCell < (Vth(OV) - VH) for 1.2 s Charge MOSFET Q1 will turn on when the voltage across the overvoltage cell falls sufficiently to overcome the internal hysteresis voltage. This can be accomplished by applying a load to the battery pack. Off to On On Active CELL DISCHARGING FAULT/RESET Discharge Current Limit Fault: VPin 16 (VPin 8 + Vth(HS dschg) for tdly(HS dschg) or VPin 5 (VPin 13 + Vth(LS dschg) for tdly(LS dschg) Discharge MOSFET Q2 is latched off and the cells are disconnected from the load. Q2 will remain in the off state as long as VPin 16 exceeds VPin 8 by VTH(HSdschrg). A discharge current limit fault can be activated by either high-side or a low-side current sensing methods. The battery pack is available for charging. The Sense Enable circuit will reset and turn on discharge MOSFET Q2 when VPin 16 no longer exceeds VPin 8 by 2.0 V. This can be accomplished by either disconnecting the load from the battery pack, or by connecting the battery pack to the charger. Undervoltage Fault Output (Pin 10) is driven low after two successive undervoltage events are detected. After a 16 second delay, discharge MOSFET Q2 is latched off, the cells are disconnected from the load, and the protection circuit enters a low current sleepmode state. The battery pack is available for charging. On On to Off Active Discharge Current Limit Reset: VPin 16 - VPin 8 < VTH(HSdschrg) VPin 5 - VPin 13 < VTH(LSdschrg) On Off to On Active Discharge Voltage Limit Fault: VCell Vth(UV) for 2.1 s On On to Off after 16 s Disabled Discharge Voltage Limit Reset: VPin 8 > (VPin 16 + 0.6 V) The Sense Enable circuit will reset and turn on discharge MOSFET Q2 when VPin 8 exceeds VPin 16 by 0.6 V. This can be accomplished by connecting the battery pack to the charger. On Off to On Active FAULTY CELL Simultaneous Charge and Discharge Voltage Limit Faults This condition can happen if there is a defective cell in the battery pack. The protection circuit will remain in the sleepmode state until the battery pack is connected to a charger. If Cell 2, or 3 is faulty and a charger is connected, the protection circuit will cycle in and out of sleepmode. If Cell 1 is faulty (<1.5 V) the protection circuit logic will not function and the battery pack cannot be charged. Cycles Cell 1 Good Cycles Cell 1 Good Cycles Cell 1 Good Disabled Cell 1 Faulty Disabled Cell 1 Faulty Disabled Cell 1 Faulty
NOTE: 3 Charge switch Q1 and discharge switch Q2 can be selectively turned off via the appropriate inhibit input except during the sleepmode state.
PROTECTION CIRCUIT OPERATING MODE TABLE
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MC33351A
OPERATING DESCRIPTION
INTRODUCTION
The demand for smaller lightweight portable electronic equipment has dramatically increased the requirements of battery performance. Today's most attractive chemistries include lithium-polymer, lithium-ion, and lithium-metal. Each of these chemistries require electronic protection in order to constrain cell operation to within the manufacturers limits. Rechargeable lithium-based cells require precise charge and discharge termination limits for both voltage and current in order to maximize cell capacity, cycle life, and to protect the end user from a catastrophic event. The MC33351A features internally-fixed cell voltage limits, programmable cell voltage balancing, low operating current, a virtually zero current sleepmode state, and requires few external components.
OPERATING DESCRIPTION
7 16 17 18 Cell 3 19 12 Cell 2 14 15 Cell 1 20 13 3 6 1 4 5
9
8
MC33351A 10
Voltage Sensing
Individual cell voltage sensing is accomplished by the use of the Cell Selector in conjunction with the Floating Over/Under Voltage Detector and Reference block. The Cell Selector applies the voltage of each cell across an internal resistor divider string. The voltage at each of the tap points is sequentially polled and compared to an internal reference. If a limit has been exceeded, the result is stored in the Over/Under Data Latch and Control Logic block. The Cell Selector is gated on for a 4.0 ms period at a fixed one second repetition rate. This low duty cycle sampling technique reduces the average load current that the divider presents across each cell, thus extending the useful battery pack capacity.
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Polling Sequence 1 2 3 4 5 6 Time (ms) 0.25 0.25 0.25 0.25 0.25 0.25 Cell Sensed Cell 1 Cell 2 Cell 3 Cell 1 Cell 2 Cell 3 Tested Limit Overvoltage Overvoltage Overvoltage Undervoltage Undervoltage Undervoltage
The MC33351A is specifically designed to be placed in the battery pack where it can be continuously powered from three lithium cells. In order to maintain cell operation within specified limits, the protection circuit senses both cell voltage and discharge current, and correspondingly controls the state of two P-channel MOSFET switches. These switches, Q1 and Q2, are placed within the series path of the positive terminal of cell 3 and the positive terminal of the battery pack. For lowside current limit sense, a resistor is placed within the series path of the negative terminal of Cell 1 and the negative terminal of the battery pack. This configuration allows the protection circuit to interrupt the appropriate charge or discharge path FET in the event that a programmed voltage or current limit for any cell has been exceeded. A functional description of the protection circuit blocks follows. Refer to the detailed block diagram shown in Figure 1.
1
2
Figure 12. Simplified Smart Battery Pack Cell Sensing Sequence
By incorporating this polling technique with a single floating comparator and voltage divider, a significant reduction of circuitry and trim elements is achieved. This results in a smaller die size, lower cost, and reduced operating current.
MC33351A
Figure 13. Cell Voltage Limit Sampling vs. Programming
From Cell Selector Floating Over/Under Cell Voltage Detector & Reference To Cell Selector Cell Voltage Discharge Voltage Threshold Charge Voltage Threshold Cell Voltage Return R1
+
Cell Voltage
R2
-
R3
capacity. Figure 13 illustrates the operation of an unbalanced three cell pack. As the cells become unbalanced, the full battery pack capacity is not realized. This is due to the requirement that charging must terminate when the highest voltage cell reaches the overvoltage limit, and discharging must terminate when the lowest voltage cell reaches the undervoltage limit. By employing a method of keeping the cell voltages equal, each of the cells can be charged and discharged to their specified limits, thus attaining the maximum possible capacity.
Figure 14. Unbalanced Battery Pack Operation
The cell charge and discharge voltage limits are controlled by the values selected for the internal resistor divider string. As the battery pack reaches full charge, the Cell Voltage Detector will sense an overvoltage fault condition on the first cell that exceeds the pre-set overvoltage limit. The fault information is stored in a data latch and charge MOSFET Q1 is turned off, disconnecting the battery pack from the charging source. An internal current source pull-up is then applied to the lower tap of the divider when the overvoltage cell is again sensed. This creates an input hysteresis voltage with divider resistors R1 and R2. As a result of an overvoltage fault, the battery pack is available for discharging only. The overvoltage fault is reset by applying a load to the battery pack. As the voltage across the highest voltage cell falls below the hysteresis level, charge MOSFET Q1 will turn on and the current source pull-up will turn off. The battery pack will now be available for charging or discharging. As the load eventually depletes the battery pack charge, the Cell Voltage Detector will sense an undervoltage fault condition on the first cell that falls below the designed undervoltage limit. After an undervoltage cell is detected, undervoltage fault output goes low and discharge MOSFET Q2 is turned off, disconnecting the battery pack from the load after 16 seconds. The protection circuit will now enter a low current sleepmode state drawing less than 15.0 nA typically, thus preventing any further cell discharging. As a result of the undervoltage fault, the battery pack is available for charging only. An alternate method of turning discharge MOSFET Q2 can be employed using RT and CT as shown in Figures 1 and 2. Recommended value of RT and CT of 5.1 kW and 22 mfd respectively generates a time delay of 110 10% milliseconds. The undervoltage fault is reset by applying charge current to the battery pack. When the voltage on Pin 8 exceeds Pin 16 by 0.6 V, discharge MOSFET Q2 will be turned on. The battery pack will now be available for charging or discharging.
Cell Voltage Balancing
Cell 3 4.2 V Overvoltage Limit Cell 2 Charge 2.7 V
Cell 3
Cell 2
4.0 V Cell 1
2.5 V Disharge Undervoltage Limit
Cell 1
Charged
Discharged
The MC33351A contains a Cell Voltage Balancing Logic circuit that controls three internal MOSFETs. These MOSFETs are connected to an external transistor and resistor combination across the individual cells. The circuit samples the voltage of each cell during the polling period. If all of the cells are below the programmed overvoltage fault limit, no cell balancing takes place. If one or more cells reach the overvoltage fault limit, a specific latch is set for each cell. At the end of the polling period, charge MOSFET Q1 is turned off and the latches are interrogated. If all of the latches were set, no cell balancing takes place. If one, two, or three latches were set, the required cell balancing MOSFETs are then activated. The overvoltage cells are discharged to the pre-set level. As each cell attains this level, the balancing MOSFETs successively turn off. Upon completion of cell balancing, charge MOSFET Q1 is turned on. Cell voltage balancing can be active during charging and discharging, but is disabled during the low current sleepmode state.
Test Mode
With series connected cells, successive charge and discharge cycles can result in a significant difference in cell voltage with a corresponding degradation of battery pack
A test option is provided to speed up device and battery pack testing. By connecting Pin 2 to 3.0 V above VC the internal logic is held in a reset state and both MOSFET switches are turned on. Upon release, the Control Logic becomes active and the cell are polled within 4.0 ms.
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MC33351A
Discharge Current Sensing
Discharge current limit protection can be selectively added to the battery pack with the addition of a sense resistor Rlim(dschg) on the Low-Side or by monitoring the voltage drop across the series FETs on the High-Side.
Sense resistor - low-side
The sense resistor Rlim(dschg) is placed in series with the negative terminal of Cell 1 and the negative terminal of the battery pack, Refer to Figure 1. As the battery pack discharges, Pins 5 and 13 sense the voltage drop across RLim(dschg). A discharge current limit fault is detected if the voltage at Pin 5 is greater than Pin 13 by 50 mV for more than 3.0 ms. The fault information is stored in a data latch and discharge MOSFET Q2 is turned off, disconnecting the battery pack from the load. As a result of the discharge current fault, the battery pack is available for charging only. The discharge current limit is given by:
circuit will turn on discharge MOSFET Q2. Discharge current sensing can be disabled by connecting Pin 16 to Pin 8. The discharge current protection circuit contains a built in response delay of 3.0 ms. This helps to prevent fault activation when the battery pack is subjected to pulsed currents during charging or discharging.
Battery Pack Application
I
+ R th(dschg) + R Lim(dschg)
Lim(dschg)
V
50 mV Lim(dschg)
Voltage across FETs - high-side
A 1M or 2M resistor connected from pin# 11 to ground is used to program the high-side discharge current limit threshold. The discharge current fault is reset by either disconnecting the load from the battery pack, or by connecting the battery pack to the charger. When the voltage on Pin 16 no longer exceeds Pin 8 by approximately 2.0 V, the Sense Enable
Each of the application figures show a capacitor labeled CI that connects directly across the battery pack terminals, and two resistors labeled Rg that are placed in series with the charge and discharge gate drive outputs. These components prevent excessive currents from flowing into the MC33351A when the battery pack terminals are shorted or arced and are mandatory. Capacitor CI is a 1.0 F 20% ceramic leaded or surface mount type. It must be placed directly across the battery pack plus and minus terminals with extremely short lead lengths (1/16") and as close to the IC as possible. The gate drive output resistors for both Q1 and Q2 are 10 k 5.o% carbon film type. In applications where inordinately low leakage MOSFETs are used, the protection circuit may take several seconds to reset from an overcurrent fault after the load is removed. If desired, this situation can be remedied by providing a small leakage path for charging CI, thus allowing Pin 8 to rapidly rise, so that it no longer exceeds Pin 16 by approximately 2.0 V. A 4.7 M resistor placed across the MOSFET switches accomplishes this task with a minimum increase in cell discharge current when the battery pack is connected to the load.
Upon assembly of the battery pack, it is imperative that Cell 1 be connected first so that VC is properly biased. The remaining cells can then be connected in any order. This assembly method prevents forward biasing the protection IC substrate which can result in overheating and non-functionality.
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MC33351A
MC33351A - Cell Voltage versus Undervoltage Fault
4.25 V ANY CELL VOLTAGE 2.30 V No FAULT FAULT remains active
High (Inactive) FAULT (pin 10) Low (Active)
1 sec + (0 - 1 sec)
16 sec (not resetable) ON DISCHARGE FET OFF
Connected CHARGER Disconnected
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MC33351A
PACKAGE DIMENSIONS
TSSOP-20 DTB SUFFIX PLASTIC PACKAGE CASE 948E-02 ISSUE A
20X
K REF
M
0.15 (0.006) T U
S
0.10 (0.004)
TU
S
V
S
K K1 J J1
L
PIN 1 IDENT 1 10
B -U-
SECTION N-N 0.25 (0.010)
N 0.15 (0.006) T U
S
A -V- N F
C D 0.100 (0.004) -T- SEATING
PLANE
G
H
DETAIL E
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III III III
M DETAIL E
2X
L/2
20
11
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. MILLIMETERS MIN MAX 6.40 6.60 4.30 4.50 --- 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.27 0.37 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.252 0.260 0.169 0.177 --- 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.011 0.015 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0 8 _ _
-W-
DIM A B C D F G H J J1 K K1 L M
MC33351A
Notes
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MC33351A
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
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For additional information, please contact your local Sales Representative.
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MC33351A/D


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